MediaTek has unveiled two new entries in its Dimensity lineup, introducing modest but meaningful upgrades focused on connectivity and power efficiency. One of the two models, the Dimensity 7450X, is specifically tuned for foldable phones, while the Dimensity 7450 targets traditional smartphone designs.
Announced this week, the Dimensity 7450 and Dimensity 7450X build on the foundation set by last year’s 7400 series. Rather than overhauling core CPU or GPU architectures, these chips bring updated modem capabilities and incremental on-device AI improvements that aim to deliver better real-world performance for mobile users.
Key specifications and changes
Both new models retain the familiar CPU and GPU configuration: four Cortex-A78 cores clocked at up to 2.6 GHz and four Cortex-A55 efficiency cores at up to 2.0 GHz, paired with a Mali-G615 MC2 GPU. The processor cluster remains optimized for a balance of performance and battery life suitable for mid-range and upper mid-range devices.
The primary improvements come from connectivity and AI optimizations. MediaTek has integrated a new 5G modem compliant with 3GPP Release 17, which the company says provides better power efficiency as well as improved throughput, coverage and reliability when compared to the previous generation’s modem. This update is intended to yield faster average speeds and smoother mobile data experiences, especially in varying network conditions.
MediaTek also highlights a roughly 7% gain in NPU (neural processing unit) performance thanks to on-chip hardware optimizations. These enhancements are focused on edge AI use cases such as camera processing, image enhancement, and other on-device inferencing tasks where both speed and energy efficiency are important.
As one of the more advanced chips in its class, the Dimensity 7450 supports the global 5G standard defined by 3GPP Release 17. This enables the latest 5G connectivity features for higher average speeds, broader coverage, and improved reliability, while maintaining strong power efficiency. The in-chip NPU enhances edge AI through hardware optimizations, increasing performance by up to 7%. AI camera tasks deliver notable performance and power efficiency improvements over the previous generation, enabling faster processing and improved energy savings.
Target devices and market positioning
MediaTek’s strategy keeps the Dimensity 7450 aimed at mainstream smartphones, while the 7450X targets foldable devices that require specialized tuning for hinge behavior, dual-screen power profiles, and differing thermal characteristics. The 7450X’s refinement for foldables suggests manufacturers will be able to bring better battery life and more reliable 5G performance to those form factors without major hardware trade-offs.
Industry sources anticipate that the Dimensity 7450X will debut in next-generation foldables and refreshed models from several manufacturers during the upcoming release cycles. The chipset’s combination of Release 17 5G support and improved NPU performance makes it a logical choice for companies producing devices that emphasize mobile connectivity and on-device AI features like enhanced photography and video processing.
Overall, the Dimensity 7450 series represents an evolutionary step that focuses on contemporary mobile priorities: improved 5G connectivity through Release 17 modem support, modest gains in edge AI performance via an optimized NPU, and specific tuning for foldable phone designs in the X variant. These updates should make upcoming mid-range and foldable devices more competitive on connectivity and camera-related AI tasks while preserving the power-efficiency profile that many consumers expect from MediaTek-powered phones.
Follow Ben: Twitter/X, Threads, Bluesky, and Instagram (profiles maintained by the author)